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IBM Collaborates with Russian Innovation Giants to Boost Microelectronics Industry 2012.07.14

Saint Petersburg, Russia - July 13, 2012 - IBM (NYSE: IBM) and five leading Russian innovation companies: the Skolkovo Foundation, Rusnano, Rostelecom, Russian Venture Company and ITFY, have signed a collaboration agreement to help spur a new wave of innovation in Russian technology. Key to the initiative is the creation of a new Electronics Technology Center (ETC) to be housed at the Skolkovo Innovation City. The agreement will give the ETC access to IBM's intellectual property for chip design.

IBM Innovate 2012 - Kristof Kloeckner, general manager, IBM Rational, discusses how IBM is helping development teams deliver software with quality, speed and agility at Innovate in Orlando, Florida.
Courtesy of IBM
 

Saint Petersburg, Russia - July 13, 2012

IBM (NYSE: IBM) and five leading Russian innovation companies: the Skolkovo Foundation, Rusnano, Rostelecom, Russian Venture Company and ITFY, have signed a collaboration agreement to help spur a new wave of innovation in Russian technology.

The five Russian companies have joined forces to foster a culture of applied research and commercialization and attract key talent and investment from around the world in the area of microelectronics.

IBM Innovate 2012 - Robert LeBlanc, Senior Vice President, Middleware Software, IBM Software Group, showcases IBM's new collaborative software development solutions for cloud and mobile technologies.
Courtesy of IBM
 
Key to the initiative is the creation of a new Electronics Technology Center (ETC) to be housed at the Skolkovo Innovation City.

The agreement will give the Electronics Technology Center access to IBM’s intellectual property for chip design.

Skolkovo Foundation President Victor Vekselberg (middle) awarding the 500th certificate and a crystal brick to Israel’s Parasight company.
Courtesy of Skolkovo Foundation
 
IBM will also provide cloud computing technologies to form the basis of a new virtual design environment to be used to develop new microelectronic devices such as sensors to be used in smarter infrastructure projects, industry and consumer electronics.

Kirill Korniliev, General Manager, IBM Russia & CIS.
Courtesy of IBM Russia
 
“IBM is leading the way in collaborative innovation,” said Kirill Korniliev, General Manager, IBM Russia & CIS.
“The ETC will use cloud technology to create a virtual working environment that brings together Russian innovation leaders where they can acquire, use and share design knowledge and spur a new wave of microelectronic innovation.”

IBM Growth Markets
IBM Branch Network in Russia & Commonwealth of Independent States (CIS).
Courtesy of IBM
 
The cloud will help unite Russia’s dispersed microelectronics development teams and provide access to advanced technologies and best practice and foster global collaboration.


Russian chip designers and fabless design houses will be able to access new semiconductor technologies, including automation tools, design kits, libraries and intellectual property.

The center will also provide access to a wide variety of semiconductor production processes offered by many different foundries.

IBM Growth Markets
IBM in engaged in a major program of geographic expansion in Russia & Commonwealth of Independent States (CIS).
Courtesy of IBM
 
The agreement was signed by:

• Victor Vekselberg, President of the Skolkovo Foundation

• Anatoly Chubais, CEO and Chairman of the Executive Board of Rosnano

• Alexander Provotorov, President and Chairman of the Management Board of Rostelecom

• Igor Agamirzian, CEO of Russian Venture Company

• Evgeny Babayan, Chairman of the Board, ITFY

• Leonid Svatkov, CEO ITFY

• Bruno Di Leo, Senior Vice President IBM

• Kirill Korniliev, Country General Manager, IBM Russia & CIS.


Evgeny Babayan, Chairman of the Board, ITFY.
Courtesy of  ITFY
 
"We are working with IBM to create an R&D ecosystem to kick start a new era in microelectronic devices design. Leveraging the latest cloud computing technologies, the Electronics Technology Center will provide customers with access to cutting-edge electronics technologies, design automation tools and specialist knowledge regardless of where they are geographically located," said Evgeny Babayan, Chairman of the Board, ITFY.

IBM is working with Russian retailer Lenta and Ukrainian retailer Epicenter to support their own geographic expansion programs.
Courtesy of IBM / an Epicenter store in Ukraine
 
The ETC will initially focus on microelectronics design; however in the future it may be extended to other fields where cloud computing can support collaborative development projects.

IBM recently announced the opening of 10 new branch offices across Russia and the Commonwealth of Independent States (CIS) as part of a major initiative to capture regional business growth and increase its presence in the fastest growing markets in the world.

The move is part of an incremental investment of $6 million that IBM will make in 2012 in the Russia and CIS region to expand its operations and increase its footprint to 22 offices.

To strengthen its support for clients and partners, IBM will also double its staff in the Russian regions and strengthen its business partner network across the Russia/CIS region to over 4,000 partners this year.

IBM currently has branches in the following cities:

• Moscow
• St. Petersburg
• Rostov-on-Don
• Kazan
• Yekaterinburg
• Perm
• Krasnoyarsk
• Novosibirsk
• Ufa
• Khabarovsk
• Tyumen
• Chelyabinsk
• Nizhniy Novgorod
• Samara
• Krasnodar
• Kiev (Ukraine)
• Dnipropetrovsk (Ukraine)
• Kharkiv (Ukraine)
• Donetsk (Ukraine)
• Almaty (Kazakhstan)
• Tashkent (Uzbekistan).


About IBM

For more information on IBM, please visit:
http://www-03.ibm.com/press/us/en/index.wss  

For more information on IBM Growth Markets please visit: https://twitter.com/#IBMGrowthMkts  


Contacts information

Alexandra Kisel
IBM Media Relations, R/CIS
+7 (985) 761 16 86
alex.kisel@ru.ibm.com  

Jonathan Batty
IBM Media Relations, Growth Markets Unit

+ 48-693-93-5403
Jonathan.Batty@pl.ibm.com  

Anastasia Tolstopyatova
IBM Media Relations, R/CIS
+7 (985) 761 16 86
Anastasia.Tolstopyatova@ru.ibm.com  


Source: IBM

http://www-03.ibm.com/press/us/en/pressrelease/38348.wss  



Victor Vekselberg

President of Skolkovo Foundation

Victor Vekselberg
Courtesy of Skolkovo Foundation
 
Born on April, 14, 1957 in Drohobych, Lvov region, Ukraine.

Graduated magna cum laude from the Moscow Transportation Engineering Institute and completed post-graduate studies in the Dorodnicyn Computing Centre of Russian Academy of Sciences.
Candidate of mathematical sciences.

In 1990 Victor Vekselberg founded an investment and business development company Renova (first a Russian-American joint enterprise) and became Chairman of the Board of Directors.
Currently holds a post of the Chairman of Board of directors of Renova Group.

In 1996 co-founded SUAL Holding and was the President of SUAL Group until 2003, when became a Chairman of Board of directors.

2002-2003 - Chairman of Tyumen Oil (TNK).
Vekselberg is currently a member of the board of directors of TNK-BP.

From 2007 - Chairman of Board of directors of United Company Rusal (UC Rusal).

Victor Vekselberg is a current member of The Russian Union of Industrialists and Entrepreneurs (RSPP), Chairman of the Committee on International Cooperation of RSPP.

In March 2010 was appointed by the President of the Russian Federation Dmitry Medvedev Head of the Russian section of Innovative Centre Project in Skolkovo.


Source: Skolkovo Foundation

http://www.sk.ru/ru-RU/Model/Team/Leadership/Vekselberg.aspx  



ASTROMAN Magazine – 2012.06.02

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ASTROMAN Magazine – 2012.04.01

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ASTROMAN Magazine – 2012.01.06

European Commission Awards IBM for Energy Efficient 27 IBM Data Centers

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IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability

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ASTROMAN Magazine – 2011.11.11

City of Rio de Janeiro and IBM Collaborate to Advance Emergency Response System

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ASTROMAN Magazine – 2011.10.15

IBM Joins European Consortium to Build a Smart Grid Using Renewable Energy

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ASTROMAN Magazine – 2011.08.13

IBM Raises Bar, Records Highest Ever TPC-C Benchmark for x86 Servers

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