wydrukuj poleć znajomym zamów materiały
Od ilu lat pracuje Pani/Pan na różnych stanowiskach menedżerskich:

powyżej 20 lat
powyżej 15 lat
powyżej 10 lat
powyżej 5 lat
poniżej 5 lat
jeszcze nie byłam/-em menedżerem
nie chcę być menedżerem


Subskrypcja najnowszych ofert pracy





Nasi partnerzy:

rp.pl
gazeta.pl
onet.pl
interia.pl
wp.pl

3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors 2011.09.08

St. Paul, Minn. & Armonk, N.Y., USA - September 07, 2011 - 3M and IBM (NYSE: IBM) today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers". The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips. Innovation leading to the creation of 'Silicon Skyscrapers'.

3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors.
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors – 3D chips.
The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package.
The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.

Courtesy of IBM
 

St. Paul, Minn. & Armonk, N.Y., USA - September 07, 2011

3M and IBM (NYSE: IBM) today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.”

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers."
Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips
.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
Processors could be tightly packed with memory and networking, for example, into a “brick” of silicon that would create a computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices
.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.

The joint research tackles some of the thorniest technical issues underlying the industry’s move to true 3D chip forms.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
“Today's chips, including those containing ‘3D’ transistors, are in fact 2D chips that are still very flat structures,” said Bernard Meyerson, VP of Research, IBM.
“Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon ‘skyscraper.’ We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low - key requirements for many manufacturers, especially for makers of tablets and smartphones.”

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 


Bonding entire wafers is a goal

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
3M and IBM plan to develop adhesives that can be applied to silicon wafers, coating hundreds or even thousands of chips at a single time
.
Current processes are akin to frosting a cake slice-by-slice.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
“Capitalizing on our joint know-how and industry experience, 3M looks forward to working alongside IBM – a leader in developing pioneering packaging for next-generation semiconductors,” said Herve Gindre, division vice president at 3M Electronics Markets Materials Division.
“3M has worked with IBM for many years and this brings our relationship to a new level. We are very excited to be an integral part of the movement to build such revolutionary 3D packaging.”

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
Adhesives are one of 3M’s 46 core technology platforms
.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
3M adhesives are precisely engineered to fit customers’ needs
and are ubiquitous - used in a multitude of diverse products and industries including high-tech applications, such as the semiconductor industry, consumer electronic devices, aerospace and solar applications.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
For more information about 3M Electronics Markets Materials Division, its products and services visit:

www.3M.com/electronicbonding  


About 3M


3M captures the spark of new ideas and transforms them into thousands of ingenious products.
Our culture of creative collaboration inspires a never-ending stream of powerful technologies that make life better.

George W. Buckley, Chairman, President and Chief Executive Officer at 3M.
Courtesy of 3M
 
3M is the innovation company that never stops inventing
.

With $27 billion in sales, 3M employs about 80,000 people worldwide and has operations in more than 65 countries.

For more information, visit www.3M.com  

or follow @3MNews on Twitter.


About IBM


For more information about IBM Microelecronics visit

www.ibm.com/chips  

 
 
For more information about IBM Research visit

www.ibm.com/research  


Contacts information

Michael Corrado
IBM Media Relations

914-766-4635
mcorrado@us.ibm.com  

Stephani Simon
Orange Communications

612-677-2121
ssimon@orange77.com  

Colleen Harris
3M
651-733-1566


Source: IBM

http://www-03.ibm.com/press/us/en/index.wss?re=2brf37  


Video
3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors


http://www-03.ibm.com/press/us/en/pressrelease/35358.wss  

or

http://www.youtube.com/watch?feature=player_embedded&v=rbj5vrXulD0  


3M Wrocław, Poland - the Industrial Adhesive and Tapes Division (IATD) plant in Wrocław, Poland.
3M Wrocław’s legal entity consists of three 3M Manufacturing Plants: IATD, AAMD (Aerospace and Aircraft Maintenance Division), and OH&ES (Occupational Health and Environmental Safety).
Courtesy of 3M
 

ASTROMAN Magazine – 2011.08.21

IBM Unveils Cognitive Computing Chips

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=1042  


ASTROMAN Magazine – 2011.08.13

IBM Raises Bar, Records Highest Ever TPC-C Benchmark for x86 Servers

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=1031  


ASTROMAN Magazine – 2011.08.06

IBM Develops Full-text Digitization System for National Diet Library of Japan

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=1027  


ASTROMAN Magazine – 2011.07.17

IBM Expands Business in Japan with New Cloud Data Centers

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=1020  


ASTROMAN Magazine – 2011.07.09

IBM Scientists Demonstrate Computer Memory Breakthrough

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=1014  


ASTROMAN Magazine – 2011.06.17

IBM's Watson Computing System Honored as "Person of the Year"

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=998  


ASTROMAN Magazine – 2011.06.12

IBM Scientists Build the First Wafer-Scale Graphene Integrated Circuit Smaller than a Pinhead

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=995  


ASTROMAN Magazine – 2011.06.02

IBM Helps City of Fort Worth and Tarrant County Create a Smarter Public Safety System

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=985  


ASTROMAN Magazine – 2011.05.15

ICM Selects IBM to Fuel National Science

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=973  


ASTROMAN Magazine – 2011.05.08

IBM Commemorates NASA's 50th Anniversary of First U.S. Manned Space Flight

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=967  


ASTROMAN Magazine – 2011.05.01

Yale School of Management and IBM Collaborate to Prepare Students for the Next Generation of Jobs

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=961  


ASTROMAN Magazine – 2011.04.21

IBM Reports 2011 First-Quarter Results

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=950  


ASTROMAN Magazine – 2011.03.18

IBM już od 18 lat najbardziej innowacyjną firmą świata

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=919  


ASTROMAN Magazine – 2011.02.20

IBM to Collaborate with Nuance to Apply IBM's "Watson" Analytics Technology to Healthcare

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=899  


ASTROMAN Magazine – 2011.02.20

IBM "Watson" to Challenge Humans at Jeopardy!

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=898  


ASTROMAN Magazine – 2010.12.25

IBM's "Watson" Computing System to Challenge All Time Greatest Jeopardy! Champions

http://www.astroman.com.pl/index.php?mod=magazine&a=read&id=864  



ASTROMAN magazine


wydrukuj ten artykuł
  strona: 1 z 1
polecamy artykuły
SAMSUNG. The Galaxy Note9 Unpacked 2018 Takes a Leap Toward a More Connected World
SAMSUNG. Nowy Galaxy Note9 - dla tych, którzy pragną mieć wszystko
LANXESS plans to sell remaining 50 percent stake in joint venture ARLANXEO to Saudi Aramco
"Pępowina" zaprojektowana w Warszawie poleci na Marsa. Mechanizm zaprojektowali i wykonali inżynierowie z SENER Polska
Cisco Announces Intent to Acquire Duo Security for USD2.35 billion
NVIDIA. Why GeForce Is the Graphics Platform of The International 2018
Pipistrel Alpha Electro aircraft. First flight of an electric aircraft in Finland
Bridgestone premieres leading-edge products and solutions offering ultimate efficiency, convenience and sustainability at IAA 2018
Harley-Davidson Accelerates Strategy to Build Next Generation of Riders Globally
China-Europe Railway Express (Zhengzhou): The Silk Rail Road Gets on Track
Volkswagen's all-electric I.D. R race car sets a new standard at the world's highest road race at the 2018 Pikes Peak International Hill Climb
The Microsoft Inspire 2018: Opening doors for partner innovation, growth and differentiation
Intercept Sets Distance Record for Lockheed Martin's Hit-to-Kill Patriot Advanced Capability PAC-3 MSE
ESA: New satellite launch extends Galileo's global reach
Atos to acquire American company Syntel to create global digital transformation leader for USD3.4 billion
strona główna  |  oferty pracy  |  executive search  |  ochrona prywatności  |  warunki używania  |  kontakt     RSS feed subskrypcja RSS
Copyright ASTROMAN © 1995-2018. Wszelkie prawa zastrzeżone.
Projekt i wykonanie: TAU CETI.