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3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors 2011.09.08

St. Paul, Minn. & Armonk, N.Y., USA - September 07, 2011 - 3M and IBM (NYSE: IBM) today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers". The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips. Innovation leading to the creation of 'Silicon Skyscrapers'.

3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors.
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors – 3D chips.
The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package.
The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.

Courtesy of IBM
 

St. Paul, Minn. & Armonk, N.Y., USA - September 07, 2011

3M and IBM (NYSE: IBM) today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.”

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers."
Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips
.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
Processors could be tightly packed with memory and networking, for example, into a “brick” of silicon that would create a computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices
.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.

The joint research tackles some of the thorniest technical issues underlying the industry’s move to true 3D chip forms.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 
“Today's chips, including those containing ‘3D’ transistors, are in fact 2D chips that are still very flat structures,” said Bernard Meyerson, VP of Research, IBM.
“Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon ‘skyscraper.’ We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low - key requirements for many manufacturers, especially for makers of tablets and smartphones.”

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.
Courtesy of IBM
 


Bonding entire wafers is a goal

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
3M and IBM plan to develop adhesives that can be applied to silicon wafers, coating hundreds or even thousands of chips at a single time
.
Current processes are akin to frosting a cake slice-by-slice.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
“Capitalizing on our joint know-how and industry experience, 3M looks forward to working alongside IBM – a leader in developing pioneering packaging for next-generation semiconductors,” said Herve Gindre, division vice president at 3M Electronics Markets Materials Division.
“3M has worked with IBM for many years and this brings our relationship to a new level. We are very excited to be an integral part of the movement to build such revolutionary 3D packaging.”

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
Adhesives are one of 3M’s 46 core technology platforms
.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
3M adhesives are precisely engineered to fit customers’ needs
and are ubiquitous - used in a multitude of diverse products and industries including high-tech applications, such as the semiconductor industry, consumer electronic devices, aerospace and solar applications.

Herve Gindre, Division Vice President at 3M Electronics Markets Materials Division - Presentation at Investor’s Conference; March 17, 2011.
Courtesy of 3M
 
For more information about 3M Electronics Markets Materials Division, its products and services visit:

www.3M.com/electronicbonding  


About 3M


3M captures the spark of new ideas and transforms them into thousands of ingenious products.
Our culture of creative collaboration inspires a never-ending stream of powerful technologies that make life better.

George W. Buckley, Chairman, President and Chief Executive Officer at 3M.
Courtesy of 3M
 
3M is the innovation company that never stops inventing
.

With $27 billion in sales, 3M employs about 80,000 people worldwide and has operations in more than 65 countries.

For more information, visit www.3M.com  

or follow @3MNews on Twitter.


About IBM


For more information about IBM Microelecronics visit

www.ibm.com/chips  

 
 
For more information about IBM Research visit

www.ibm.com/research  


Contacts information

Michael Corrado
IBM Media Relations

914-766-4635
mcorrado@us.ibm.com  

Stephani Simon
Orange Communications

612-677-2121
ssimon@orange77.com  

Colleen Harris
3M
651-733-1566


Source: IBM

http://www-03.ibm.com/press/us/en/index.wss?re=2brf37  


Video
3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors


http://www-03.ibm.com/press/us/en/pressrelease/35358.wss  

or

http://www.youtube.com/watch?feature=player_embedded&v=rbj5vrXulD0  


3M Wrocław, Poland - the Industrial Adhesive and Tapes Division (IATD) plant in Wrocław, Poland.
3M Wrocław’s legal entity consists of three 3M Manufacturing Plants: IATD, AAMD (Aerospace and Aircraft Maintenance Division), and OH&ES (Occupational Health and Environmental Safety).
Courtesy of 3M
 

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